Hongduo Liu, Ph.D. Student Department of Computer Science and Engineering The Chinese University of Hong Kong Email: liuhongduosc@gmail.com

Biography

I am currently a Ph.D. student at the Department of Computer Science and Engineering, The Chinese University of Hong Kong (CUHK), under the supervision of Prof. Bei Yu and Prof. Tsung-Yi Ho since Fall 2021. Previously, I received my Bachelor's Degrees in IoT Engineering and Applied Mathematics from University of Electronic Science and Technology of China (UESTC) in 2020.

Research Interest

• Verification

• Electronic Design Automation

• Hardware/Software Co-Design

Publication

• [C6] Hongduo Liu, Peng Xu, Yuan Pu, Lihao Yin, Hui-Ling Zhen, Mingxuan Yuan, Tsung-Yi Ho, Bei Yu, “NeuroSelect: Learning to Select Clauses in SAT Solvers”, ACM/IEEE Design Automation Conference (DAC), San Francisco, Jun. 23–27, 2024.

• [C5] Hongduo Liu, Peiyu Liao, Junhua Huang, Hui-Ling Zhen, Mingxuan Yuan, Tsung-Yi Ho, Bei Yu, “Parallel Grobner Basis Rewriting and Memory Optimization for Efficient Multiplier Verification”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Valencia, Spain, Mar. 25–27, 2024.

• [C4] Peiyu Liao, Hongduo Liu, Yibo Lin, Bei Yu, Martin Wong, “On a Moreau Envelope Wirelength Model for Analytical Global Placement”, ACM/IEEE Design Automation Conference (DAC), San Francisco, Jul. 09–13, 2023.

• [C3] Hongduo Liu, Peiyu Liao, Mengchuan Zou, Bowen Pang, Xijun Li, Mingxuan Yuan, Tsung-Yi Ho, Bei Yu, “Layout Decomposition via Boolean Satisfiability”, ACM/IEEE Design Automation Conference (DAC), San Francisco, Jul. 09–13, 2023.

• [C2] Guojin Chen, Ziyang Yu, Hongduo Liu, Yuzhe Ma, Bei Yu, “DevelSet: Deep Neural Level Set for Instant Mask optimization”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Nov. 1–4, 2021.

• [C1] Jiahao Liu, Zhen Zhu, Yong Zhou, Ning Wang, Guanghai Dai, Qingsong Liu, Jianbiao Xiao, Yuxiang Xie, Zirui Zhong, Hongduo Liu, Liang Chang, Jun Zhou, “BioAIP: A Reconfigurable Biomedical AI Processor with Adaptive Learning for Versatile Intelligent Health Monitoring”, IEEE International Solid-State Circuits Conference (ISSCC), Feb. 13–22, 2021.

• [J4] Hongduo Liu, Peiyu Liao, Mengchuan Zou, Bowen Pang, Xijun Li, Mingxuan Yuan, Tsung-Yi Ho, Bei Yu, “Layout Decomposition via Boolean Satisfiability”, accepted by IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).

• [J3] Hongduo Liu, Yijian Qian, Youqiang Liang, Bin Zhang, Zhaohan Liu, Tao He, Wenqian Zhao, Jiangbo Lu, Bei Yu, “A High-Performance Accelerator for Real-Time Super-Resolution on Edge FPGAs”, ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 29, no. 3, pp. 1–25, 2024.

• [J2] Jiahao Liu, Jiajing Fan, Zirui Zhong, Hui Qiu, Jianbiao Xiao, Yong Zhou, Zhen Zhu, Guanghai Dai, Ning Wang, Qingsong Liu, Yuxiang Xie, Hongduo Liu, Liang Chang, Jun Zhou, “An Ultra-low Power Reconfigurable Biomedical AI Processor with Adaptive Learning for Versatile Wearable Intelligent Health Monitoring”, IEEE Transactions on Biomedical Circuits and Systems (TBioCAS), vol. 17, no. 5, pp. 952-967, 2023.

• [J1] Guojin Chen, Ziyang Yu, Hongduo Liu, Yuzhe Ma, Bei Yu, “DevelSet: Deep Neural Level Set for Instant Mask Optimization”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 42, no. 12, pp. 5020–5033, 2023.

Experience

SmartMore

• C++ Engineer

• Shenzhen, P.R.China, Aug.2020 - Jun.2021
  

Awards

• Full Postgraduate Studentship, CUHK, 2021-2025

• Outstanding Graduate, UESTC, 2020

• First Class Outstanding Academic Scholarship, UESTC, 2017, 2018, 2019