Hongduo Liu, Ph.D. Student Department of Computer Science and Engineering The Chinese University of Hong Kong Email: liuhongduosc@gmail.com

Biography

I am currently a Ph.D. student at Department of Computer Science and Engineering, The Chinese University of Hong Kong (CUHK), under the supervision of Prof. Bei Yu since Fall 2021. Previously, I received my Bachelor's Degrees in IoT Engineering and Applied Mathematics from University of Electronic Science and Technology of China (UESTC) in 2020.

Research Interest

• Electronic Design Automation

• Hardware/Software Co-Optimization

Publication

• [C4] Peiyu Liao, Hongduo Liu, Yibo Lin, Bei Yu, Martin Wong, “On a Moreau Envelope Wirelength Model for Analytical Global Placement”, ACM/IEEE Design Automation Conference (DAC), San Francisco, Jul. 09–13, 2023.

• [C3] Hongduo Liu, Peiyu Liao, Mengchuan Zou, Bowen Pang, Xijun Li, Mingxuan Yuan, Tsung-Yi Ho, Bei Yu, “Layout Decomposition via Boolean Satisfiability”, ACM/IEEE Design Automation Conference (DAC), San Francisco, Jul. 09–13, 2023.

• [C2] Guojin Chen, Ziyang Yu, Hongduo Liu, Yuzhe Ma, Bei Yu, “DevelSet: Deep Neural Level Set for Instant Mask optimization”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Nov. 1–4, 2021.

• [C1] Jiahao Liu, Zhen Zhu, Yong Zhou, Ning Wang, Guanghai Dai, Qingsong Liu, Jianbiao Xiao, Yuxiang Xie, Zirui Zhong, Hongduo Liu, Liang Chang, Jun Zhou, “BioAIP: A Reconfigurable Biomedical AI Processor with Adaptive Learning for Versatile Intelligent Health Monitoring”, IEEE International Solid-State Circuits Conference (ISSCC), Feb. 13–22, 2021.

Experience

SmartMore

• C++ Engineer

• Shenzhen, P.R.China, Aug.2020 - Jun.2021
  

Awards

• Full Postgraduate Studentship, CUHK, 2021-2025

• Outstanding Graduate, UESTC, 2020

• First Class Outstanding Academic Scholarship, UESTC, 2017, 2018, 2019